Surface Defect Free

Glass Spacer Wafer

Steep Side Walls

Capping Wafer

Laser Induced Etching for Wafer Level Packaging

New opportunities for glass

Due to its excellent compatibility with silicon, glass is already regularly used in wafer level packaging. LIDE enables the improvement of existing and the development of new glass-based wafer level packaging approaches.

Closed Cavities with Steep Sidewalls in Glass

Apertures in Glass with Steep Sidewalls