Read about LIDE technology
Interviews & articles
Interactive Presentation Paper by LPKF Honored at ECTC (Electronic Components and Technology Conference)
“Processing Glass Substrate for Advanced Packaging Using Laser Induced Deep Etching - by LPKF Laser & Electronics AG“
The Executive Committee of ECTC has judged the presentation paper on LIDE to be the Outstanding Interactive Presentation Paper at the 70th ECTC held virtually in June 2020.
The paper discusses a specific potential application of the LIDE technology in semiconductor packaging, which is at the final stage in the production of integrated circuits. We propose the use of glass as the core material for these components, with unique structures that could solve critical issues that normally lead to lower yield and higher costs during production, while also adding more functionality to them. These can only be created using LIDE, because of our technology’s versatility, precision and the fact that it doesn’t generate any defects in the glass.
Yole Développement and i-MICRONEWS about a new technology for high aspect ratio microstructures in glass
Dr. Roman Ostholt had the pleasure to discuss the benefits of LIDE technology with Amandine Pizzagalli, one of the analysts of Yole Développement , published at i-MICRONEWS (external link below). One of the biggest applications in microsystems manufacturing is microfluidics, where tiny and precise device cavities and micro-holes must be made economically. Yole Développement has recently released a dedicated report on this industry, which also refers to LIDE technnology.