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LIDE Technology
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Glass for Heterogeneous Integration
Through Glass Vias (TGV)
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Through Glass Via (TGV) Wafer
Embedding Wafer
Spacer Wafer
Capping Wafer
High Definition PicoWell Arrays
Fine Glass Mask
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LIDE Technology
Applications
Glass for Heterogeneous Integration
Through Glass Vias (TGV)
Wafer Level Packaging
Microfluidics
Display Cover Glass
Foldable Display
Your Specific Application
Products
Through Glass Via (TGV) Wafer
Embedding Wafer
Spacer Wafer
Capping Wafer
High Definition PicoWell Arrays
Fine Glass Mask
Newsletter
My Vitrion Foundry
Contact
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