Glass Embedding Wafer

Next Level Advanced Packaging

Polymers play a vital role in modern electronics packaging schemes. But they also have their limitation. LIDE processed glass can help to overcome these issues.

Limited die shift especially
Passive die alignment for lowest die position inaccuracies
Lower warpage due to high Young's modulus of glass
Can be combined with Through Glass Vias and Integrated Passives
Can readily be scaled to panel-level-manufacturing

Glass Wafer

Glass Thickness: <0.9 mm
Minimum aperture: 10 µm (round)
Positional accuracy: +-5 µm
Taper Angle: 1° to 7° (depending on glass type)
Chipping: None
Microcracks: None
Substrate Size and Format: All standard wafer sizes up to 450 mm and glass panels up to 510x510 mm²