Glass Spacer Wafer

Bringing Wafer Level Packaging at a new level of quality and precision

Benefits of using LIDE technology for Glass Spacer Wafer

  • Higher accuracy
  • Free of any surface defects (chipping, microcracks, thermal induced stress)
  • Steep sidewalls
  • Odd shapes

Glass Wafer

Specifications

  • Glass Thickness: <0.9 mm
  • Minimum aperture: 10 µm (round)
  • Positional accuracy: +-5 µm
  • Taper Angle: 1° to 7° (depending on glass type)
  • Chipping: None
  • Microcracks: None
  • Substrate Size and Format: All standard wafer sizes up to 450 mm and glass panels up to 510x510 mm²

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Vitrion Glass Spacer (PDF - 300,35 KB)
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Pricing

LIDE is a high throughput technology which allows us to offer high quality glass substrates at an appealing price point. Let us convince you.