Reliable Interconnects in Glass

Glass Wafer with Through Vias

Reliable Interconnects in Glass

Glass Wafer with Through Vias

Glass Wafer with Through Vias

High Quality Microholes in Standard Glasses

For the metallization of microholes are different methods available. Whatever metallization process you want to use, we support you with the production of glass wafers and panels with microholes according to your specifications. We can create v-shaped vias as well as hour-glass shaped vias.

V-Shaped Through Glass Via

Hour Glass Shaped Through Glass Vias

Glass Wafer with Microholes for TGV

Specifications

  • Glass Thickness: <0.9 mm
  • Minimum microhole diameter: 10 µm
  • Positional accuracy: +-5 µm
  • Taper Angle: 1° to 7° (depending on glass type)
  • Chipping: None
  • Microcracks: None
  • Substrate Size and Format: All standard wafer sizes up to 450 mm and glass panels up to 510x510 mm²

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LIDE TGV Glass Wafer Specifications
TGV Wafer (PDF - 213,93 KB)
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Pricing

LIDE is a high throughput technology which allows us to offer high quality glass substrates at an appealing price point. Let us convince you.