Fairs & Events
Meet the vitrion team
March 4th, Fountain Hills, Arizona, USA
IMAPS 16th International Conference and Exhibition on Device Packaging
The conference is dedicated to 3D Integration, Fan-Out, Wafer Level Packaging & Flip Chip, Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Gen Applications.
Jean-Pol Delrue (Vitrion) will speak about Micro-Features in Glass using Laser Induced Deep Etching for Device Packaging.
The international event is organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
If you would like to make an appointment, please contact us.