Fairs & Events

Meet the vitrion team

In this section you can find information on upcoming trade shows and conferences.

March 4th, Fountain Hills, Arizona, USA

IMAPS 16th International Conference and Exhibition on Device Packaging

The conference is dedicated to 3D Integration, Fan-Out, Wafer Level Packaging & Flip Chip, Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Gen Applications.

Jean-Pol Delrue (Vitrion) will speak about Micro-Features in Glass using Laser Induced Deep Etching for Device Packaging.

The international event is organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

If you would like to make an appointment, please contact us.