Fairs & Events
Meet the vitrion team
March 4th, Fountain Hills, Arizona, USA
IMAPS 16th International Conference and Exhibition on Device Packaging
The conference is dedicated to 3D Integration, Fan-Out, Wafer Level Packaging & Flip Chip, Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Gen Applications.
Jean-Pol Delrue (Vitrion) will speak about Micro-Features in Glass using Laser Induced Deep Etching for Device Packaging.
The international event is organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
If you would like to make an appointment, please contact us.
27 - 29 Jan 2020, Dresden, Germany
3D & Systems Summit
The event will address the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing.
The summit will focus on high reliability and high performance of disruptive applications like Mobile and IoT. Invited distinguished global industry speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.
If you would like to make an appointment, please contact us.