Glass for Heterogeneous Integration

Supporting the next
generation of
Advanced Packaging

Through Glass Vias

Enabling Glass Interposer

Glass for Heterogeneous Integration

LIDE enables glass to become a new platform for Advanced Packaging application

Due to economic limitations, a growing number of advanced packaging schemes today still rely on a limited number of materials such as epoxy moulding compounds and other polymer substrates. Now, LIDE technology is paving the way for solid glass substrates to be applied in advanced packaging.

Glass Interposer

Glass offers the possibility to drastically reduce the cost of interposers. An essential prerequisite for this is the economical production of through glass vias of very high quality.
The LIDE process allows you to achieve this. In addition, it also offers the possibility of manufacturing integrated passives and introducing dicing structures.


LIDE processed glass wafers or glass panels can further improve the nowadays very popular Fan-Out packages. The advantages are manifold:

  • Lower Warpage
    Glass has a significantly higher Young’s modulus than epoxy molding compound or other polymers. The coefficient of thermal expansion (CTE) of glasses can be matched to the CTE of silicon dies. This reduces the mismatch of thermal expansion, which causes the warpage of reconstituted wafers.
  • Lower Die Shift
    The very precisely manufactured LIDE cavities in glass limit the die shift. Which can be further limited by passive alignment structures.
  • RF Properties
    Glass is known for its excellent radio frequency properties. Compared to packaging made of other materials, devices with thin glass packaging feature lower power consumption and better reception.
  • Integration of additional features
    Through Glass Vias, Integrated Passives, Passive Die and/or Fiber Alignment
  • Supports panel level manufacturing