Through Glass Via

Perfect Through Glass Via

Tapered Through Glass Vias

Surface Defect Free

Through Glass Via

Perfect Through Glass Vias

Laser Induced Etching for Through Glass Vias (TGV)

Reliable interconnects through glass

Masked isotropic wet etching of glass is not capable to make micro-features of aspect ratios larger than one. Standard laser drilling of glasses is typically associated with low throughput and hidden micro-cracks and thermal induced stress which can lead to yield loss and or catastrophic failures of the final devive. 

In contrast to conventially drilled micro holes, through glass vias made by LIDE are free of micro cracks, chipping, thermal stress. In addtion to its premium quality LIDE processed Through Glass Vias score with high precision and repeatability.

 Specifications of LIDE made Through Glass Vias

In addition to the general beneficial characteristics of LIDE, the technology can offer specific advantages for through via formation in glass.
Via diameter

The minimum via diameter is 10 µm. Typically, all micro-holes on one substrate show the same diameter.

Different diameters are possible by applying multiple etching runs.

Aspect ratio

Typically, the aspect ratio is in the range of 1:10 but depending on glass type it can also be as high as 1:50.

Side wall

The side walls of LIDE-generated micro-holes are smooth, crack-free, chip-free, and stress-free, enabling reliable metallization.

The taper angle is between 0.1° -30°.

Via shapes

LIDE-made micro-holes typically have an hour-glass shape.

V-shaped micro-holes are possible by limiting the etching to take place from one side of the previously modified glass only.

Substrate size

All wafer sizes: 100 mm,150 mm, 200 mm, 300 mm, 450 mm
Panel formats: smaller than 510 x 510 mm²
Glass thickness: < 0.9mm