Laser Induced Etching for Through Glass Vias (TGV)
Reliable interconnects through glass
Masked isotropic wet etching of glass is not capable to make micro-features of aspect ratios larger than one. Standard laser drilling of glasses is typically associated with low throughput and hidden micro-cracks and thermal induced stress which can lead to yield loss and or catastrophic failures of the final devive.
In contrast to conventially drilled micro holes, through glass vias made by LIDE are free of micro cracks, chipping, thermal stress. In addtion to its premium quality LIDE processed Through Glass Vias score with high precision and repeatability.
Specifications of LIDE made Through Glass Vias
The minimum via diameter is 10 µm. Typically, all micro-holes on one substrate show the same diameter.
Different diameters are possible by applying multiple etching runs.
Typically, the aspect ratio is in the range of 1:10 but depending on glass type it can also be as high as 1:50.
The side walls of LIDE-generated micro-holes are smooth, crack-free, chip-free, and stress-free, enabling reliable metallization.
The taper angle is between 0.1° -30°.
LIDE-made micro-holes typically have an hour-glass shape.
V-shaped micro-holes are possible by limiting the etching to take place from one side of the previously modified glass only.